Job description
**Job Title: Packaging and Interconnect Engineer**
In this role, you will focus on the design and development of cutting-edge packaging and interconnect strategies for power System-in-Package (SiP) solutions, modules, and wafer-level packaging. You will oversee the qualification process, partnering with OSAT and Contract Manufacturers (CM) to enhance production efficiency and maintain top-tier manufacturing quality. The position requires a degree in Physics, Chemistry, or Engineering, accompanied by 10-15 years of pertinent experience in power SiP and wafer-level packaging. Proven analytical abilities and in-depth knowledge of assembly methodologies, qualification techniques, and statistical analysis are critical for success in this position.
