Tempe, Arizona, 85281
Job description
**Job Title: Packaging and Interconnect Engineer**
In this role, you will focus on the design and development of cutting-edge packaging and interconnect strategies for power System-in-Package (SiP) solutions, modules, and wafer-level packaging. You will oversee the qualification process, partnering with OSAT and Contract Manufacturers (CM) to enhance production efficiency and maintain top-tier manufacturing quality. The position requires a degree in Physics, Chemistry, or Engineering, accompanied by 10-15 years of pertinent experience in power SiP and wafer-level packaging. Proven analytical abilities and in-depth knowledge of assembly methodologies, qualification techniques, and statistical analysis are critical for success in this position.
STEMHUNTER is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, sexual orientation, gender identity, and gender expression), national origin, age, disability, genetic information, veteran status, or any other status protected by applicable federal, state, or local law. We comply with all applicable equal employment opportunity and affirmative action regulations.
