**Job Title: Packaging and Interconnect Engineer**
In this role, you will focus on the design and development of cutting-edge packaging and interconnect strategies for power System-in-Package (SiP) solutions, modules, and wafer-level packaging. You will oversee the qualification process, partnering with OSAT and Contract Manufacturers (CM) to enhance production efficiency and maintain top-tier manufacturing quality. The position requires a degree in Physics, Chemistry, or Engineering, accompanied by 10-15 years of pertinent experience in power SiP and wafer-level packaging. Proven analytical abilities and in-depth knowledge of assembly methodologies, qualification techniques, and statistical analysis are critical for success in this position.
Renesas Electronics provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
