Job Summary
The role involves overseeing packaging programs from the initial design phase to qualification, ensuring that decisions made are technically sound and suitable for manufacturing across various products including FPGA, embedded SoC, and custom ASICs. The individual will act as the main contact for customers regarding packaging issues and will lead diverse teams alongside suppliers to address challenges, meet commitments, and maintain program timelines.
Responsibilities
- Manage packaging programs from architecture through to qualification.
- Make informed and manufacturable decisions applicable to FPGA, embedded SoC, and custom ASIC products.
- Function as the primary customer-facing contact for packaging-related inquiries.
- Lead cross-functional teams and coordinate with suppliers to troubleshoot issues.
- Ensure that commitments are fulfilled and programs adhere to scheduled timelines.
Qualifications
- Possess expert-level knowledge in semiconductor packaging integration, especially with 2.5D/3D technologies.
- Experience in IC-package-PCB co-design as well as DFM, DFMEA, and PFMEA methodologies.
- Proven ability to engage directly with customers and lead cross-functional teams effectively.
- Strong communication skills are essential for interacting with stakeholders.
- A bachelor’s or master’s degree in an engineering discipline is required.
