Job description
**Job Title: Semiconductor Packaging Development Lead**
We are seeking a Semiconductor Packaging Development Lead to design cutting-edge packaging modules and spearhead the advancement of new materials and processes for logic, DRAM, and NAND technologies. In this role, you will guide cross-departmental initiatives and establish engineering strategies to address intricate technical issues in semiconductor packaging. A bachelor’s or master’s degree in engineering is necessary for this position, with a PhD being preferable. Ideal candidates should possess over 10 years of experience in semiconductor packaging development and manufacturing.
