San Jose, California, 95113

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Onsite
$58240 - $141440/yr

Job Summary

The internship focuses on the creation and calibration of Computational Fluid Dynamics (CFD) models for HBM stacks and packages. These models will act as a reference for efficient and compact thermal simulation models. The intern will engage in the development of methods for homogenization and implement model-order reduction techniques to enhance the speed of thermal solvers used in the design of AI memory systems.

Responsibilities

  • Develop and calibrate CFD models for HBM stacks and packages.
  • Create compact thermal models to serve as benchmarks.
  • Implement homogenization techniques for thermal performance analysis.
  • Utilize model-order reduction to expedite thermal solvers in AI memory system design.

Qualifications

  • Pursuing a PhD or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a comparable discipline.
  • Strong understanding of heat transfer principles.
  • Hands-on experience with numerical methods.
  • Proficiency in scientific programming using Python or MATLAB.

Samsung Semiconductor provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
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Back to Top Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)
Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)
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supports..pdf, .doc, .docx, or .txt file