Own and improve assembly processes and equipment, especially wirebonding and eutectic die attach, to increase yield, efficiency, cycle time, reliability, and equipment performance. Qualify new tools and processes, support new product introductions, analyze process variation, and train operators while collaborating across engineering and manufacturing teams. Requires a bachelor’s degree in electrical, mechanical, materials engineering, or a related field with 8 years of relevant experience, or a master’s degree with 5 years of semiconductor packaging and assembly experience in manufacturing. Candidates should have hands-on assembly tool and metrology experience, expertise in die attach, SPC and DOE, failure analysis, equipment troubleshooting, and data analysis, along with strong communication and mentoring skills.
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