Job Summary
The role involves enhancing and maintaining assembly processes and machinery, focusing on wire bonding and eutectic die attach methods. The aim is to boost yield, operational efficiency, cycle times, reliability, and overall equipment performance. The position also encompasses the qualification of new tools and methodologies, assisting in the introduction of new products, and analyzing variations in processes while providing training to operators and engaging in collaboration with various engineering and manufacturing teams.
Responsibilities
- Improve assembly processes and equipment, particularly in wirebonding and eutectic die attach.
- Enhance yield, efficiency, cycle time, reliability, and performance of equipment.
- Qualify new tools and processes, supporting product introductions.
- Analyze process variations and provide necessary training for operators.
- Collaborate across engineering and manufacturing departments.
Qualifications
- A bachelor’s degree in electrical, mechanical, materials engineering, or a related discipline, with 8 years of relevant experience, or a master’s degree with 5 years in semiconductor packaging and assembly manufacturing.
- Proficiency with assembly tools and metrology is essential.
- Expertise in die attach, Statistical Process Control (SPC) and Design of Experiments (DOE), failure analysis, and equipment troubleshooting.
- Strong analytical skills for data analysis, alongside excellent communication and mentoring abilities.
Nokia provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
