Job Summary
The role involves spearheading and expanding the application engineering team to effectively incorporate single-crystal diamond materials into semiconductor products utilizing innovative bonding and packaging techniques. Responsibilities encompass overseeing the development of processes, validating these methods, and facilitating the transition from prototype stages to large-scale manufacturing.
Responsibilities
- Lead the integration of single-crystal diamond in semiconductor applications.
- Direct the development and validation of advanced bonding and packaging processes.
- Manage technology transfer from initial prototyping to high-volume production.
- Ensure efficient process scaling to meet mass production requirements.
Qualifications
- A Bachelor’s degree in a pertinent engineering discipline.
- A minimum of 10 years of relevant experience in semiconductor packaging or thermal management.
- Extensive hands-on experience with wafer/die bonding technologies.
- A solid history of successfully scaling processes for large-scale manufacturing.
Diamond Foundry provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
