Job Summary
The position entails leading the conceptualization, creation, and validation of advanced memory packages for Apple products. This role requires effective collaboration with partner roadmaps and internal engineering teams to achieve enhancements in bandwidth and density.
Responsibilities
- Oversee the definition and development of next-gen memory packages.
- Engage in collaboration with partner roadmaps to align project goals.
- Work alongside internal engineering teams to promote advancements in performance metrics such as bandwidth and density.
- Address thermal challenges and integrate knowledge of SI/PI co-design into package development.
Qualifications
- Bachelor’s degree in a relevant field.
- Minimum of 10 years of hands-on experience in package design and assembly.
- Proficient understanding of thin-die stacking techniques and thermal management.
- Strong grasp of signal integrity (SI) and power integrity (PI) co-design principles.
Apple provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
