The R&D Principal Engineer will develop novel materials and integration solutions for advanced semiconductor devices and 3D structures. Responsibilities include hands-on cleanroom fabrication, material synthesis, and collaboration with cross-functional teams to support next-generation IC technologies. Candidates must hold a Ph.D. in Physics, Materials Science, Chemistry, Electrical Engineering, or a related field. Strong expertise in thin-film deposition, cleanroom processing, and device characterization is required.
TSMC provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
