Oversee the entire process of developing, qualifying, and producing advanced FCBGA packages, from initial concept to large-scale manufacturing. Ensure effective technical execution by coordinating with substrate suppliers and OSAT partners, while fostering collaboration across different functions to address quality and reliability challenges. This role demands significant expertise in assembly manufacturing of FCBGA, laminate substrate technologies, and the introduction of new products for advanced flip-chip packages. Strong project management abilities and a track record of successfully leading cross-functional teams and managing supplier relationships are crucial.
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