Job Summary
This position requires an individual to establish and direct a competent CPO packaging team, focusing on the management of global OSAT partnerships. The primary objective is to facilitate the progression of products from initial concepts to high-volume manufacturing, emphasizing the technical advancement of co-packaged photonic assemblies while strictly adhering to manufacturing and reliability guidelines.
Responsibilities
- Lead and develop a proficient team specialized in CPO packaging.
- Manage relationships with global OSAT partners to ensure seamless product transitions from concept to production.
- Oversee the technical growth of co-packaged photonic assemblies.
- Guarantee compliance with rigorous manufacturing standards and reliability requirements.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or Physics.
- Minimum of 5 years of experience in semiconductor packaging.
- Demonstrated expertise in managing co-packaged optics and supplier relations.
- Strong leadership acumen with a history of team management.
