**Job Title: Semiconductor Packaging Development Lead**
We are seeking a Semiconductor Packaging Development Lead to design cutting-edge packaging modules and spearhead the advancement of new materials and processes for logic, DRAM, and NAND technologies. In this role, you will guide cross-departmental initiatives and establish engineering strategies to address intricate technical issues in semiconductor packaging. A bachelor’s or master’s degree in engineering is necessary for this position, with a PhD being preferable. Ideal candidates should possess over 10 years of experience in semiconductor packaging development and manufacturing.
Applied Materials provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
