Job Summary
The primary focus of this role is to create and assess novel power packaging solutions specifically for datacenter and automotive applications. This position involves close collaboration with various product lines and suppliers to ensure effective product integration and performance.
Responsibilities
- Develop innovative power packages tailored for datacenter and automotive sectors.
- Coordinate efforts with different product lines and suppliers to support product development.
- Conduct packaging tradeoff analyses to identify the best design alternatives.
- Utilize thermal and mechanical modeling techniques to achieve optimal performance in design, manufacturability, and reliability.
Qualifications
- Bachelor’s degree in Electrical, Materials, or Mechanical Engineering.
- Minimum of 5 years of experience in packaging-related activities.
Texas Instruments provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
